All materials
Controlled expansion alloys
Osprey® CE9F
Controlled expansion aluminium-silicon alloy, Si-40%Al, with a room-temperature expansion of 9.1 ppm/°C and a density of 2.47 g/cc. Machined components for electronics packaging, photonics and space hardware.
Physical, mechanical and thermal properties
| Composition | Si-40%Al |
|---|---|
| Tensile strength, MPa | 181 |
| Young's modulus, GPa | 118 |
| Density, g/cc | 2.47 |
| Hardness, HV | 230 |
| Thermal conductivity at 25°C, W/m·K | 121 |
| Thermal conductivity at 200°C, W/m·K | 108 |
| CTE at room temp., ppm/°C | 9.1 |
| CTE 25–200°C, ppm/°C | 10.2 |
| CTE 25–500°C, ppm/°C | 11.4 |
Supplied as
Machined components to drawing, from billet. Controlled expansion alloys are not supplied as powder.