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02 · Materials

Built to scale beyond powder

The platform is defined by metallurgical mastery, not by a single product form. Controlled expansion alloys sit alongside our atomised powders as proof of that principle.

Product forms

What we make

AM · L-PBF / EBM / DED

Powders for additive manufacturing

High-sphericity, low-oxygen powders with controlled morphology and rheology for laser and electron beam systems at production scale.

MIM

Powders for metal injection moulding

Fine-cut, narrow particle size distributions for precision components held to density and surface finish requirements.

HIP · Near-net shape

Pre-alloyed powders for consolidation

Nickel superalloys, titanium and tool steels for hot isostatic pressing and near-net-shape production.

CE alloys

Controlled expansion alloys

Engineered to hold dimension across temperature where electronics, optics and aerospace assemblies demand it. Osprey CE7 and related grades.

Specification

Named for what they are

Materials are named by metallurgy and standard, and cited against the recognised specification where one applies.

Alloy systemSpecificationTypical cuts
Ti-6Al-4V ASTM F3001 · F2924 15–45 µm · 45–106 µm
Ni superalloys AMS 5662 · 5663 class 15–53 µm · 53–150 µm
Stainless 316L ASTM A276 chemistry 15–45 µm · 45–106 µm
Cobalt chrome ASTM F75 15–45 µm
Tool steels Customer specification Cut to process
Osprey CE7 Controlled expansion Ingot · machined form
Adjacent

Where the platform extends

Deliberately, and only where the metallurgy is genuinely ours. Osprey patented silicon alloys for electronic packaging in 2001.

01

Powders · AM / MIM / HIP

02

Controlled expansion alloys

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Thermal & electronic materials

04

Adjacent advanced materials